Please use this identifier to cite or link to this item: http://hdl.handle.net/11189/9126
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dc.contributor.authorTyavambiza, Carolineen_US
dc.contributor.authorMeyer, Mervinen_US
dc.contributor.authorMeyer, Samanthaen_US
dc.date.accessioned2023-06-20T12:15:29Z-
dc.date.available2023-06-20T12:15:29Z-
dc.date.issued2022-
dc.identifier.citationTyavambiza, C., Meyer, M. & Meyer, S. 2022. Cellular and molecular events of wound healing and the potential of silver based nanoformulations as wound healing agents. Bioengineering, 9: 712. [https://doi.org/10.3390/ bioengineering9110712]en_US
dc.identifier.issn2306-5354-
dc.identifier.urihttp://hdl.handle.net/11189/9126-
dc.description.abstractChronic wounds are a silent epidemic threatening the lives of many people worldwide. They are associated with social, health care and economic burdens and can lead to death if left untreated. The treatment of chronic wounds is very challenging as it may not be fully effective and may be associated with various adverse effects. New wound healing agents that are potentially more effective are being discovered continuously to combat these chronic wounds. These agents include silver nanoformulations which can contain nanoparticles or nanocomposites. To be effective, the discovered agents need to have good wound healing properties which will enhance their effectiveness in the different stages of wound healing. This review will focus on the process of wound healing and describe the properties of silver nanoformulations that contribute to wound healing.en_US
dc.language.isoenen_US
dc.publisherMDPIen_US
dc.relation.ispartofBioengineeringen_US
dc.subjectWound healingen_US
dc.subjectantimicrobialen_US
dc.subjectantioxidanten_US
dc.subjectanti-inflammatoryen_US
dc.subjectsilver nanoparticlesen_US
dc.subjectsilver nanocompositesen_US
dc.titleCellular and molecular events of wound healing and the potential of silver based nanoformulations as wound healing agentsen_US
dc.identifier.doihttps://doi.org/10.3390/ bioengineering9110712-
dc.typeArticleen_US
Appears in Collections:HWSci - Journal Articles (DHET subsidised)
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